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The product is a silver white powder suitable for the conductive phase in electronic pastes.
The microstructure of the powder is granular, with a size in the micrometer range, characterized by low silver content, good dispersibility, high tap density, and concentrated particle size distribution.
The electronic paste made of this powder is suitable for low-temperature sintering process, and the formed electrode has good conductivity.

Fully meet MLCC copper slurry
♦ high-crystallized
♦ High oxidation resistance
♦ Spherical and flaky copper powder

FGA series glass powder is mainly used as a bonding phase for sintered electronic pastes, with a firing temperature of 600 ℃ -800 ℃. Its main characteristics are:

•Narrow particle size distribution, easy to disperse

• Stable chemical properties and high weather resistance

• Has good wettability and good substrate compatibility